Package

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Passive: Rectangular passive components (mostly resistors and capacitors)

SMD

SMT sizes.png
  • 01005 (0402 metric): 0.4 mm × 0.2 mm (0.016 in × 0.0079 in). Typical power rating for resistors = 0.031 watt[8]
  • 0201 (0603 metric): 0.6 mm × 0.3 mm (0.024 in × 0.012 in). Typical power rating for resistors = 0.05 watt[8]
  • 0402 (1005 metric): 1.0 mm × 0.5 mm (0.039 in × 0.020 in). Typical power rating for resistors = 0.1 [8] or 0.062 watt[9]
  • 0603 (1608 metric): 1.6 mm × 0.8 mm (0.063 in × 0.031 in). Typical power rating for resistors = 0.1 watt[8]
  • 0805 (2012 metric): 2.0 mm × 1.25 mm (0.079 in × 0.049 in). Typical power rating for resistors = 0.125 watt[8]
  • 1008 (2520 metric): 2.5 mm × 2.0 mm (0.098 in × 0.079 in). Typical inductor and ferrite bead package[10]
  • 1206 (3216 metric): 3.2 mm × 1.6 mm (0.13 in × 0.063 in). Typical power rating for resistors = 0.25 watt[8]
  • 1210 (3225 metric): 3.2 mm × 2.5 mm (0.13 in × 0.098 in). Typical power rating for resistors = 0.5 watt[8]
  • 1806 (4516 metric): 4.5 mm × 1.6 mm (0.18 in × 0.063 in)[11]
  • 1812 (4532 metric): 4.5 mm × 3.2 mm (0.18 in × 0.13 in). Typical power rating for resistors = 0.75 watt[8]
  • 2010 (5025 metric): 5.0 mm × 2.5 mm (0.20 in × 0.098 in). Typical power rating for resistors = 0.75 watt[8]
  • 2512 (6332 metric): 6.4 mm × 3.2 mm (0.25 in × 0.13 in). Typical power rating for resistors = 1 watt[8]
  • 2920: 7.4 mm × 5.1 mm (0.29 in × 0.20 in)[12]

DIP

Resistor DIP.jpg

DIPresistance encapsulated as AXIAL-xx form (eg AXIAL-0.3, AXIAL-0.4), on behalf of the pad center spacing xx inches.
Common Package: AXIAL-0.3, AXIAL-0.4, AXIAL-0.5, AXIAL-0.6, AXIAL-0.7, AXIAL-0.8, AXIAL-0.9, AXIAL-1.0.

Three-terminal packages

SOT.jpg
  • SOT: Small Outline Transistor, three terminals
  • SOT-223: 6.7 mm × 3.7 mm × 1.8 mm body: four terminals, one of which is a large heat-transfer pad
  • SOT-89: 4.5 mm × 2.5 mm × 1.5 mm body: four terminals, center pin is connected to a large heat-transfer pad
  • SOT-23 (SC-59, TO-236-3): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: three terminals for a transistor
  • SOT-323 (SC-70): 2 mm × 1.25 mm × 0.95 mm body: three terminals
  • SOT-416 (SC-75): 1.6 mm × 0.8 mm × 0.8 mm body: three terminals
  • SOT-663: 1.6 mm × 1.6 mm × 0.55 mm body: three terminals
  • SOT-723: 1.2 mm × 0.8 mm × 0.5 mm body: three terminals: flat lead
  • SOT-883 (SC-101): 1 mm × 0.6 mm × 0.5 mm body: three terminals: leadless
  • DPAK (TO-252, SOT-428): Discrete Packaging. Developed by Motorola to house higher powered devices. Comes in three- or five-terminal versions
  • D2PAK (TO-263, SOT-404): bigger than the DPAK; basically a surface mount equivalent of the TO220 through-hole package. Comes in 3, 5, 6, 7, 8 or 9-terminal versions
  • D3PAK (TO-268): even larger than D2PAK

Five- and six-terminal packages

SOT: small-outline transistor, with more than three terminals

  • SOT-23-5 (SOT-25): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: five terminals
  • SOT-23-6 (SOT-26): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: six terminals
  • SOT-23-8 (SOT-28): 2.9 mm × 1.3/1.75 mm × 1.3 mm body: eight terminals
  • SOT-353 (SC-88A): 2 mm × 1.25 mm × 0.95 mm body: five terminals
  • SOT-363 (SC-88, SC-70-6): 2 mm × 1.25 mm × 0.95 mm body: six terminals
  • SOT-563: 1.6 mm × 1.2 mm × 0.6 mm body: six terminals
  • SOT-665: 1.6 mm × 1.6 mm × 0.55 mm body: six terminals
  • SOT-666: 1.6 mm × 1.6 mm × 0.55 mm body: six terminals
  • SOT-886: 1.5 mm × 1.05 mm × 0.5 mm body: six terminals: leadless
  • SOT-886: 1 mm × 1.45 mm × 0.5 mm body: six terminals: leadless
  • SOT-891: 1.05 mm × 1.05 mm × 0.5 mm body: five terminals: leadless
  • SOT-953: 1 mm × 1 mm × 0.5 mm body: five terminals
  • SOT-963: 1 mm × 1 mm × 0.5 mm body: six terminals
  • SOT-1115: 0.9 mm × 1 mm × 0.35 mm body: six terminals: leadless
  • SOT-1202: 1 mm × 1 mm × 0.35 mm body: six terminals: leadless

Packages with more than six terminals

Dual-in-line

  • flatpack was one of the earliest surface-mounted packages.
  • SOIC: (Small-Outline Integrated Circuit), dual-in-line, 8 or more pins, gull-wing lead form, pin spacing 1.27 mm
  • SOJ: Small-Outline Package, J-Leaded, the same as SOIC except J-leaded [48]
  • TSOP: Thin Small-Outline Package, thinner than SOIC with smaller pin spacing of 0.5 mm
  • SSOP: Shrink Small-Outline Package, pin spacing of 0.65 mm, sometimes 0.635 mm or in some cases 0.8 mm
  • TSSOP: Thin Shrink Small-Outline package.
  • QSOP: Quarter-Size Small-Outline package, with pin spacing of 0.635 mm,
  • VSOP: Very Small Outline Package, even smaller than QSOP; 0.4, 0.5 mm or 0.65 mm pin spacing
  • DFN: Dual Flat No-lead, smaller footprint than leaded equivalent

Quad-in-line

  • PLCC: Plastic Leaded Chip Carrier, square, J-lead, pin spacing 1.27 mm
  • QFP: Quad Flat Package, various sizes, with pins on all four sides
  • LQFP: Low-profile Quad Flat Package, 1.4 mm high, varying sized and pins on all four sides
  • PQFP: Plastic Quad Flat-Pack, a square with pins on all four sides, 44 or more pins
  • CQFP: Ceramic Quad Flat-Pack, similar to PQFP
  • MQFP: Metric Quad Flat Pack, a QFP package with metric pin distribution
  • TQFP: Thin Quad Flat Pack, a thinner version of PQFP
  • QFN: Quad Flat No-lead, smaller footprint than leaded equivalent
  • LCC: Leadless Chip Carrier, contacts are recessed vertically to "wick-in" solder. Common in aviation electronics because of robustness to mechanical vibration.
  • MLP (MLF): Micro Leadframe Package (Micro Lead-Frame package) with a 0.5 mm contact pitch, no leads (same as QFN)
  • PQFN: Power Quad Flat No-lead, with exposed die-pad[s] for heatsinking

Grid arrays

  • PGA: Pin grid array.
  • BGA: Ball Grid Array, with a square or rectangular array of solder balls on one surface, ball spacing typically 1.27 mm
  • LGA: An array of bare lands only. Similar to in appearance to QFN, but mating is by spring pins within a socket rather than solder.
  • FBGA: Fine pitch Ball Grid Array, with a square or rectangular array of solder balls on one surface
  • LFBGA: Low profile Fine pitch Ball Grid Array, with a square or rectangular array of solder balls on one surface, ball spacing typically 0.8 mm
  • TFBGA: Thin Fine pitch Ball Grid Array, with a square or rectangular array of solder balls on one surface, ball spacing typically 0.5 mm
  • CGA: Column Grid Array, circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern.
  • CCGA: Ceramic Column Grid Array, circuit package in which the input and output points are high temperature solder cylinders or columns arranged in a grid pattern. The body of the component is ceramic.
  • μBGA: micro-BGA, with ball spacing less than 1 mm
  • LLP: Lead Less Package, a package with metric pin distribution (0.5 mm pitch).

Non-packaged devices

(although surface-mount, these devices require specific process for assembly):

  • COB: Chip-On-Board; a bare silicon chip, that is usually an integrated circuit, is supplied without a package (usually a lead frame overmolded with epoxy) and is attached, often with epoxy, directly to a circuit board. The chip is then wire bonded and protected from mechanical damage and contamination by an epoxy "glob-top".
  • COF: Chip-On-Flex; a variation of COB, where a chip is mounted directly to a flex circuit.
  • COG: Chip-On-Glass; a variation of COB, where a chip, typically a Liquid crystal display (LCD) controller, is mounted directly on glass:.

Crystal

Image Description Eagle Library
100 32.768 KHz (12.5pF) for timekeeping crystal.libr:crystal:TC38H
5mhzcrystal t.jpg 5.0000 MHz in HC-49 package crystal.libr:crystal:HC49
Hc49u t.jpg 3.579545 MHz ("colorburst") crystal crystal.libr:crystal:HC49

Tantalum Capacitor

refer to page Tantalum capacitor

Note

Pitch

0.05 inch equals to 1.27 mm, SOP has 0.05 inch pitch and SSOP has 0.025 inch pitch, check in following images:

How to find package in Eagle

  1. Open the Board editor,
  2. Hit the Add button (or command)
  3. Search for *SOIC*
  4. It will show you all the SOIC packages. There should be one in ref-packages.

Auto generate symmetric SMD

All units in mm. Use eagle symmetric SMD package ULP to generate following footprint.

Package Type Family A (Length) B (Width) B1 (Body Width) P (Pitch)
SO-P8 Dual SOP 4.9 6 3.9 1.27
SOP-16 Dual SOP 9.9 6 3.9 1.27
SOP-20 Dual SOP 12.8 10.3 7.5 1.27
SOP-28 Dual SOP 17.9 10.325 7.5 1.27
SSOP8 Dual SSOP 2.9 6 3.9 0.64
SSOP16 Dual SSOP 4.9 6 3.9 0.64
SSOP20 Dual SSOP 8.65 6 3.9 0.64
SSOP28 Dual SSOP 9.9 6 3.9 0.64
SSOP48 Dual SSOP 16 10.4 7.6 0.635
MSOP10 Dual MSOP 3 4.9 3 0.5
TSSOP10 Dual TSSOP 3 6.4 4.4 0.65
TSSOP14 Dual TSSOP 5 6.4 4.4 0.65
TSSOP20 Dual TSSOP 6.5 6.4 4.4 0.65
TQFP32 Quad TQFP 7 7 5 0.5
TQFP32-0.8P Quad TQFP 9 9 7 0.8
TQFP64-0.8P Quad TQFP 16 16 14 0.8
TQFP48 Quad TQFP 9 9 7 0.5
LQFP64 Quad LQFP 12 12 10 0.5
TQFP100 Quad TQFP 16 16 14 0.5

Reference